单组份LED灌封胶 电子电感防水灌封胶厂家 斯巴克供

单组份LED灌封胶 电子电感防水灌封胶厂家 斯巴克供 

CQ18P-A1 型电子产品**黑胶

CQ18P-A1 Potting Compound for Electronic Product

技  术  指  标

（Specifications）

测试标准

1.软化点                                                               >123         ASTM  D36-86

Softening Point(℃)

2.灌封温度                                              143-153

Pouring Temperature(℃)

3.热导率                                                  >4.5         ASTM  D6

Heat Conductivity

(*BTU-Inch/DegF/Sq.ft/hr.)

4.收缩率                                                  <2.0

Percent Shrinkage (%, at 125℃-25℃)

5.针入度                                                  1.4-2.0      ASTM  D5

Penetration (mm, at 25℃/100g/5 sec)

6.介电强度 （KV）                                   >23

Dielectric Strength (KV)

7.闪点 (℃)                                               >280       ASTM  D92

Flash point (℃)

8.比重                                                     1.4-1.6     ASTM  D176

Specific Gravity

9.0物质                                              无

Toxicity